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Wednesday, July 6, 2011

WSJ: Thinner, lighter iPhone is expected this fall

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The WSJ reports on the next generation iPhone due this fall (with some contradictions):

According to some suppliers of components to Apple, the new version of the iPhone is expected to be thinner and lighter than the iPhone 4 and sport an 8-megapixel camera. One person said the new iPhone will operate on Qualcomm Inc.’s wireless baseband chips. The current iPhone 4 uses memory chips made by Samsung Electronics Co. and baseband chips from German chip maker Infineon Technologies AG, according to a report by market-research firm iSuppli Corp.

How can the iPhone have both Infineon and Qualcomm basebands? Verizon execs have already said the next iPhone will be a CSM/CDMA world phone - which means it is likely that it will use Qualcomm’s Gobi chips (As the current Verizon iPhone and iPad currently do).

The “two different iPhones” model could be at work here as well. Perhaps the Infineon iPhones address the cheap, prepaid global GSM market?

There is some question about whether or not the production of these devices will meet production deadlines, however.
(http://9to5mac.com/)

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